Description

Label and Press: KE-468J – Achieving Excellence Through Precision

Pre-Milling, Bonding, and Track Trimming Operations

Product Highlights:

Proficient Profiling: Our KDT patented technology ensures meticulous profiling, elevating the tactile and visual outcomes of workpiece processing. This innovative approach offers four distinct profiling effects.
Bonding and Pressing Mechanism: Embracing an effective procedure, boards are transported to the gluing device via a conveyor belt. Utilizing the gluing shaft, the board receives an adhesive layer. Subsequently, the cutting mechanism removes the excess edge banding, which is then positioned and secured evenly through the pressing mechanism.
Precision Alignment: Our front and rear aligning mechanism utilizes a precise linear guide rail to trim the surplus edge banding from the board’s edges. This guarantees a smooth and seamless finish. An automated lubrication system further ensures the smooth operation of the head mechanism, augmenting part longevity.

Revolutionizing Edge Technology

Flexibility and Intelligent Manufacturing

As a distinguished pioneer in the field of edge banders, we are unwavering in our commitment to detail, innovation, and research and development. Responding to the diverse needs of our clientele, KDT continually introduces cutting-edge international technology and integrates components from industry-leading brands. This dedication culminates in the provision of top-tier products to customers worldwide.

Comprehensive Solution for Intelligent Home Furniture Manufacturing

Technical Specifications:

Model: KE-468J

Feeding Speed: 15-23 m/min

Tape Thickness: 0.4-3 mm

Panel Thickness: 9-60 mm

Panel Length: ≥120 mm

Panel Width: ≥90 mm

Minimum Panel Size: 120 mm x 90 mm

Total Power: 21.15 kW

Overall Dimensions: 6479 mm (L) x 830 mm (W) x 1700 mm (H)

Dust Hood Specifications: φ1002 + φ1254

Key Advantages

Proficient Profiling: Our KDT patented technology ensures meticulous profiling, elevating the tactile and visual outcomes of workpiece processing. This innovative approach offers four distinct profiling effects.
Bonding and Pressing Mechanism: Embracing an effective procedure, boards are transported to the gluing device via a conveyor belt. Utilizing the gluing shaft, the board receives an adhesive layer. Subsequently, the cutting mechanism removes the excess edge banding, which is then positioned and secured evenly through the pressing mechanism.
Precision Alignment: Our front and rear aligning mechanism utilizes a precise linear guide rail to trim the surplus edge banding from the board’s edges. This guarantees a smooth and seamless finish. An automated lubrication system further ensures the smooth operation of the head mechanism, augmenting part longevity.