Description
The PLc Model Hot Press is a low-tonnage press designed for gluing chipboard and Formica, as well as other applications that do not require high thrust. Available in two standard sizes, the PLc series can also be customized according to customer requirements.
The PLc Model Hot Press features assembled serpentine work surfaces with an aluminum covering. The coil is covered with calibrated 3mm thick sheet metal, while the aluminum foil covering provides an excellent surface finish and efficient heat distribution.
The PLc Model Hot Press uses a water heating system with a maximum fluid of 85°C. The system includes an electric boiler, water recirculation pump, pipes, and insulation to reduce heat loss.
Applications:
- Gluing chipboard
- Gluing Formica
- Applications that do not require high thrust
Standard Size:
- 2500 x 1300mm
- 3000 x 1300mm
- Custom sizes available according to customer requirements
Work Surfaces:
- Assembled serpentine work surfaces
- Aluminum covering
- Coil covered with calibrated 3mm thick sheet metal
- Aluminum foil for surface finish and heat distribution
Available Models:
PLc.a
- Upper movable work surface
- Movement from top to bottom
PLc.b
- Lower movable work surface
- Movement from bottom to top
Standard Equipment:
- Structure composed of assembled and welded S275JR beams
- Manual opening by lever
- Pressure gauge on the control panel
- Handwheel for pressure adjustment
- Pressure sealing tap
Water Heating System:
- Heating Fluid: Water
- Maximum Fluid Temperature: 85°C
- Heating Time: 40 minutes
- Protection: Insulation
- Hoses: Flexible rubber
- Electric boiler
- Water recirculation pump
- Pipes and insulation to reduce heat loss
Optional Equipment:
- Extra stroke of 650mm
- Pressure recovery
- Electric opening
The PLc Model Hot Press combines low-tonnage pressing with water-heated serpentine work surfaces for chipboard, Formica, and other applications that do not require high thrust. With two available configurations and customizable standard sizes, the PLc Model Hot Press can be configured according to different pressing requirements.
